产品规格: | LQPF48 | 产品数量: | 10000.00 个 |
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包装说明: | 整包 | 价格说明: | 不限 |
查看人数: | 180 人 | 本页链接: | https://info.b2b168.com/s168-34343426.html |
STM32F101x8/B-ST 32位单片机特点描述: Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces 包括:STM32F101x8和STM32F101xB系列.基本参数和订购信息如下: 品名 单片机|MCU|微控制器 品牌 ST-意法半导体 规格描述 MCU ARM 32位 STM32F101系列 64KB~128KB FLASH 库存情况 深圳现货 参考价格 详情请咨询:陈小姐 STM32F101x8/B规格明细 : STM32F101x8/B依据封装尺寸、程序存储器容量、工作温度、包装方式等4项参数分成了众多具体型号,请采购人员按自己的要求进行正确选型,不明白的可以直接我司业务员咨询。 料号 封装尺寸 程序存储器容量 工作温度 包装 较小包装 STM32F101C8T6 48-LQFP 64KB(64K x 8) -40°C ~ 85°C 托盘 250 STM32F101C8T6TR 48-LQFP 64KB(64K x 8) -40°C ~ 85°C 带卷 (TR) 2400 STM32F101C8U6 48-VFQFN 64KB(64K x 8) -40°C ~ 85°C 托盘 260 STM32F101C8U6TR 48-LFQFN-LLHP 64KB(64K x 8) -40°C ~ 85°C 带卷 (TR) 2500 STM32F101R8T6 64-LQFP 64KB(64K x 8) -40°C ~ 85°C 托盘 160 STM32F101R8T6TR 64-LQFP 64KB(64K x 8) -40°C ~ 85°C 带卷 (TR) 1000 STM32F101T8U6 36-VFQFN 64KB(64K x 8) -40°C ~ 85°C 托盘 490 STM32F101T8U6TR 36-VFQFN 64KB(64K x 8) -40°C ~ 85°C 带卷 (TR) 3000 STM32F101V8T6 100-LQFP 64KB(64K x 8) -40°C ~ 85°C 托盘 90 STM32F101V8T6TR 100-LQFP 64KB(64K x 8) -40°C ~ 85°C 带卷 (TR) 1000 STM32F101TBU6 36-VFQFN 128KB(128K x 8) -40°C ~ 85°C 托盘 490 STM32F101VBT6 100-LQFP 128KB(128K x 8) -40°C ~ 85°C 托盘 90 STM32F101VBT6TR 100-LQFP 128KB(128K x 8) -40°C ~ 85°C 带卷 (TR) 1000 STM32F101CBT6 48-LQFP 128KB(128K x 8) -40°C ~ 85°C 托盘 250 STM32F101CBT6TR 48-LQFP 128KB(128K x 8) -40°C ~ 85°C 带卷 (TR) 2400 STM32F101RBH6 64-TFBGA 128KB(128K x 8) -40°C ~ 85°C 托盘 640 STM32F101RBT6 64-LQFP 128KB(128K x 8) -40°C ~ 85°C 托盘 160 STM32F101RBT6TR 64-LQFP 128KB(128K x 8) -40°C ~ 85°C 带卷 (TR) 1000 Full compatibility throughout the family The STM32F101xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are referred to as low-density devices, the STM32F101x8 and STM32F101xB are referred to as medium-density devices, and the STM32F101xC, STM32F101xD and STM32F101xE are referred to as high-density devices. Low- and high-density devices are an extension of the STM32F101x8/B devices, they are specified in the STM32F101x4/6 and STM32F101xC/D/E datasheets, respectively. Lowdensity devices feature lower Flash memory and RAM capacities and a timer less. Highdensity devices have higher Flash memory and RAM capacities, and additional peripherals like FSMC and DAC, while remaining fully compatible with the other members of the STM32F101xx family. The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD and STM32F101xE are a drop-in replacement for the STM32F101x8/B medium-density devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle. Moreover, the STM32F101xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.