深圳斯普瑞溙科技有限公司是一家**从事半导体后道封装测试贴片及邦定工艺相关耗材、测试工艺耗材及治具、封装测试设备备件的研发设计、生产、销售于一体的企业。公司成立于2009年。


	     公司拥有一个半导体制造技术经验丰富的团队，不定期地与国外进行技术交流，不断地进行新技术、新工艺的开发和改进，使公司在半导体封装测试工艺日新月异的变化中发展壮大，技术得到积累和提升。随着半导体封装测试加工向**薄，**小的方向发展，对相关的辅助工装治具及工艺的要求越来越高，公司通过使用新的材料，研发设计革新相关辅助治具，提出工艺改进建议，与客户一起携手解决遇到的技术难题，使客户在低成本，**中赢得市场，达到双赢效果。


	      公司凭借良好的技术团队，**的产品，准时的交货，**的客户服务，合理的价格，已经与诸多的国际，国内的IC封装厂商建立了长期的合作关系，赢得了客户的认可。


	我们提供的产品及服务如下:


	1)贴片及邦定工艺耗材：陶瓷吸嘴，常温橡胶吸嘴，高温橡胶吸嘴，电木吸嘴，引线框架吸嘴，顶针，点胶头，点胶针，打火杆。


	2）测试工业耗材及治具：各种封装系类的测试爪/片（QFN,DFN,SOP,DIP,SOT,SOD,TO-XXX),测试座及POGO PIN,(BGA,QFN,DFN,QFP,FLIP CHIP)


	3)封装测试设备备件（ISMECA,ASM,ESEC,OE,MUHLBAUER)  


	公司网址/  


	


	  Shenzhen Springtech Technology Co., Ltd ,founded in 2009,is a professional supplier of semiconductor assembly and test tooling parts . Our main areas of focus are die bond , wire bond ,testing processes and the related equipment spare parts . We have our own capability in design , manufacturing and assembly in the various fields of the Semiconductor Industry .  


	


	  Springtech has a team of people with rich experience in semiconductor manufacturing . As a technology company , we recognize the importance of technique and innovation . Therefore we place a high priority in areas of co-operation with overseas partners and embrace new technology , process development moving towards smaller and thinner devices , it is a great challenge for the related manufacturing tools . We are ready to take on these challenges and provide solutions using our core techniques , new materials and process development . In short .we hope to help our customers achieve their targets efficiently with low cost and high quality , enabling all parties to be in a win-win situation .


	   With our continuous efforts to pursue technique innovation , high quality , on-time delivery , customer satisfaction with competitive pricing , we managed to establish long-term co-operation with many IC assembly companies, gaining a soild reputation and recogntion from the industry.


	


	Range of products/services:


	1.Die Bond/Wire Bond tooling:


	 - Ceramic collect tip , rubber tip , high temperature rubber tip , Vespel tip , Lead Frame suction cup , Die ejector needle , Epoxy dispensing nozzles , EFO body .


	2.Testing tools:


	 - (for all package types)Contact Fingers , pogo pin , test socket.


	3.Spare parts :


	 - Machine spare parts for ISMECA , ASM , SRM , ESEC , OE , MUHLBAUER and more.

深圳斯普瑞溙科技有限公司专注于测试爪金手指厂家,测试爪金手指销售,橡胶吸嘴,橡胶吸嘴价格,橡胶吸嘴定制,橡胶吸嘴厂家,半导体测试设备,弹簧针等